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 TCM828/TCM829
Switched Capacitor Voltage Converters
Features
* * * * * * * Charge Pump in 5-Pin SOT-23 Package >95% Voltage Conversion Efficiency Voltage Inversion and/or Doubling Low 50 A (TCM828) Quiescent Current Operates from +1.5V to +5.5V Up to 25 mA Output Current Only Two External Capacitors Required
Description
The TCM828/TCM829 devices are CMOS "chargepump" voltage converters in ultra-small, 5-Pin SOT-23 packages. They invert and/or double an input voltage which can range from +1.5V to +5.5V. Conversion efficiency is typically >95%. Switching frequency is 12 kHz for the TCM828, and 35 kHz for the TCM829. External component requirement is only two capacitors (3.3 F nominal) for standard voltage inverter applications. With a few additional components, a positive doubler can also be built. All other circuitry, including control, oscillator and power MOSFETs, are integrated on-chip. Supply current is 50 A (TCM828) and 115 A (TCM829). The TCM828 and TCM829 devices are available in a 5-Pin SOT-23 surface mount package.
Applications
* * * * * LCD Panel Bias Cellular Phones Pagers PDAs, Portable Dataloggers Battery-Powered Devices
Typical Application Circuit
Voltage Inverter C+ C1 CTCM828/TCM829 VIN INPUT
Package Type
TCM828/TCM829 SOT-23
OUT 1
5
C+
VIN OUT C2 VOUTPUT
2
GND
C-
3
4
GND
Ordering Information
Part No. TCM828ECT TCM828VT TCM829ECT Note: Package 5-Pin SOT-23 5-Pin SOT-23 5-Pin SOT-23 Temperature Range -40C to +85C -40C to +125C -40C to +85C
5-Pin SOT-23 is equivalent to EIAJ SC-74A.
(c) 2010 Microchip Technology Inc.
DS21488B-page 1
TCM828/TCM829
NOTES:
DS21488B-page 2
(c) 2010 Microchip Technology Inc.
TCM828/TCM829
1.0 ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings
Input Voltage (VIN to GND) .................................. +30V Output Voltage (OUT to GND) ...................6.0V, +0.3V Current at OUT Pin ............................................ 50 mA Short-Circuit Duration - OUT to GND ............Indefinite Operating Temperature Range ................ -40C to +85C Variable Temp. Range (TCM828 only) ............................... .............................................................................-40C to +125C Power Dissipation (TA 70C) ........................ 240 mW Storage Temperature (Unbiased)..........-65C to +150C Lead Temperature (Soldering, 10 sec)............ +300C
ELECTRICAL CHARACTERISTICS (0C TO +85C)
Electrical Specifications: TA = 0C to +85C, VIN = +5V, C1 = C2 = 10 F (TCM828), C1 = C2 = 3.3 F (TCM829), unless otherwise noted. Typical values are at TA = +25C. Parameters Supply Current Minimum Supply Voltage Maximum Supply Voltage Oscillator Frequency Power Efficiency Voltage Conversion Efficiency Output Resistance Note 1: Sym IDD V+ V+ FOSC PEFF VEFF ROUT Min -- -- 1.5 -- 8.4 24.5 -- 95 -- -- Typ 50 115 -- -- 12 35 96 99.9 25 -- Max 90 260 -- 5.5 15.6 45.5 -- -- 50 65 Units A A V V kHz kHz % % Conditions TCM828, TA = +25C TCM829, TA = +25C RLOAD = 10 k, TA = 0C to +85C RLOAD = 10 k TCM828, TA = +25C TCM829, TA = +25C ILOAD = 3 mA,TA = +25C RLOAD = IOUT = 5 mA,TA = +25C IOUT = 5 mA,TA = 0C to +85C
Capacitor contribution is approximately 20% of the output impedance [ESR = 1/pump frequency x capacitance)].
ELECTRICAL CHARACTERISTICS (-40C TO +85C)
Electrical Specifications: TA = -40C to +85C, VIN = +5V, C1 = C2 = 10 F (TCM828), C1 = C2 = 3.3 F (TCM829), unless otherwise noted. Typical values are at TA = +25C. (Note 1) Parameters Supply Current Supply Voltage Range Oscillator Frequency Output Resistance Note 1: Sym IDD V+ FOSC ROUT Min -- -- 1.5 6 19 -- Typ -- -- -- -- -- -- Max 115 325 5.5 15.6 45.5 65 Units A A V kHz kHz TCM828 TCM829 RLOAD = 10 k TCM828 TCM829 IOUT = 5 mA Conditions
All -40C to +85C specifications above are assured by design.
(c) 2010 Microchip Technology Inc.
DS21488B-page 3
TCM828/TCM829
NOTES:
DS21488B-page 4
(c) 2010 Microchip Technology Inc.
TCM828/TCM829
2.0
Note:
TYPICAL CHARACTERISTICS
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specifiedoperating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Circuit of Figure 5-3, VIN = +5V, C1 = C2 = C3, TA = +25C, unless otherwise noted.
70
OUTPUT RESISTANCE () OUTPUT CURRENT (mA)
40 35 30 25 20 15 10 5 0 1.5 2.5 3.5 4.5 0
VIN = 4.75V, VOUT = - 4.0V
60 50 40 30 20 10 0 SUPPLY VOLTAGE (V)
VIN = 3.15V, VOUT = - 2.5V
TCM828
TCM829
VIN = 1.9V, VOUT = -1.5V
10
20
30
40
CAPACITANCE (F)
FIGURE 2-1: Supply Voltage.
80
OUTPUT RESISTANCE ()
Output Resistance vs.
FIGURE 2-3: vs. Capacitance.
40
TCM828 - Output Current
60 50 40 30 20 10 0 -40C
VIN = 1.5V
OUTPUT CURRENT (mA)
70
35 30 25 20 15 10 5 0
0C 25C 85C
VIN = 4.75V, V- = - 4.0V
VIN = 3.15V, V- = - 2.5V
VIN = 3.3V VIN = 5.0V
VIN = 1.9V, VOUT = - 1.5V
0
5
10
15
20
25
30
35
TEMPERATURE (C)
CAPACITANCE (F)
FIGURE 2-2: Temperature.
Output Resistance vs.
FIGURE 2-4: vs. Capacitance.
TCM829 - Output Current
(c) 2010 Microchip Technology Inc.
DS21488B-page 5
TCM828/TCM829
Note:Circuit of Figure 5-3, VIN = +5V, C1 = C2 = C3, TA = +25C, unless otherwise noted.
OUTPUT VOLTAGE RIPPLE (mVp-p)
450
PUMP FREQUENCY (kHz)
14
400 350 300 250 200 150 100 50 0 0
VIN = 5.0V VIN = 3.3V VIN = 1.5V
VIN = 4.75V, VOUT = - 4.0V
12 10 8 6 4 2 0 -40
VIN = 3.15V, VOUT = - 2.5V VIN = 1.9V, VOUT = - 1.5V
5
10
25
20
25
30
35
5
0C
25C
85C
CAPACITANCE (F)
TEMPERATURE (C)
FIGURE 2-5: TCM828 - Output Voltage Ripple vs. Capacitance.
OUTPUT VOLTAGE RIPPLE (mVp-p)
FIGURE 2-8: vs. Temperature.
45
PUMP FREQUENCY (kHz)
TCM828 - Pump Frequency
300 250 200
VIN = 4.75V, VOUT = - 4.0V
40
VIN = 5.0V VIN = 3.3V VIN = 1.5V
35 30
25 20 15 10 5
VIN = 3.15V, VOUT = - 2.5V
150 100 50 0 0 5 10 15 20 30 35 CAPACITANCE (F)
VIN = 1.9V, VOUT = - 1.5V
0 -40C
0C
25C
85C
TEMPERATURE (C)
FIGURE 2-6: TCM829 - Output Voltage Ripple vs. Capacitance.
120
SUPPLY CURRENT (A)
FIGURE 2-9: vs. Temperature.
0
OUTPUT VOLTAGE (V)
TCM829 - Pump Frequency
p
100 80 60 40 20 0 1.5 2 2.5 3 3.5 4 4.5 5 5.5 SUPPLY VOLTAGE (V)
-1
VIN = 2.0V
-2 -3 -4
TCM829
VIN = 3.3V
TCM828
VIN = 5.0V
-5 -6 0 10 20 30 40 50 OUTPUT CURRENT (mA)
FIGURE 2-7: Voltage.
Supply Current vs. Supply
FIGURE 2-10: Current.
Output Voltage vs. Output
DS21488B-page 6
(c) 2010 Microchip Technology Inc.
TCM828/TCM829
Note: Circuit of Figure 5-3, VIN = +5V, C1 = C2 = C3, TA = +25C, unless otherwise noted.
y
100
p
VIN = 5.0V
EFFICIENCY (%)
80
VIN = 3.3V VIN =1.5V
60
40 0 10 20 30 40 OUTPUT CURRENT (mA) 50
FIGURE 2-11: Current.
Efficiency vs. Output
(c) 2010 Microchip Technology Inc.
DS21488B-page 7
TCM828/TCM829
NOTES:
DS21488B-page 8
(c) 2010 Microchip Technology Inc.
TCM828/TCM829
3.0 PIN DESCRIPTION
PIN FUNCTION TABLE
Symbol OUT VIN C1GND C1+ Inverting charge pump output Positive power supply input Commutation capacitor negative terminal Ground Commutation capacitor positive terminal Function The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
TCM828/TCM829 SOT-23 1 2 3 4 5
(c) 2010 Microchip Technology Inc.
DS21488B-page 9
TCM828/TCM829
NOTES:
DS21488B-page 10
(c) 2010 Microchip Technology Inc.
TCM828/TCM829
4.0 DETAILED DESCRIPTION
The TCM828/TCM829 charge pump converters invert the voltage applied to the VIN pin. Conversion consists of a two phase operation (Figure 4-1). During the first phase, switches S2 and S4 are open, while S1 and S3 are closed. During this time, C1 charges to the voltage on VIN and load current is supplied from C2. During the second phase, S2 and S4 are closed, and S1 and S3 are open. This action connects C1 across C2, restoring charge to C2. S1 C1 S2
IN
TCM828/ TCM829
C2 S3 S4 VOUT = -(VIN)
FIGURE 4-1: Charge Pump.
Ideal Switched Capacitor
(c) 2010 Microchip Technology Inc.
DS21488B-page 11
TCM828/TCM829
NOTES:
DS21488B-page 12
(c) 2010 Microchip Technology Inc.
TCM828/TCM829
5.0
5.0.1
APPLICATIONS INFORMATION
OUTPUT VOLTAGE CONSIDERATIONS
The losses in the circuit due to factor 4 above are also shown in Equation 5-2. The output voltage ripple is shown in Equation 5-3.
The TCM828/TCM829 devices perform voltage conversion, but do not provide regulation. The output voltage will droop in a linear manner with respect to load current. The value of this equivalent output resistance is approximately 25 nominal at +25C and VIN = +5V. VOUT is approximately - 5V at light loads, and droops according to the equation below: VDROOP = IOUT x ROUT VOUT = -(VIN -VDROOP)
EQUATION 5-2:
P LOSS ( 4 ) = [ ( 0.5 ) ( C1 ) ( V - 2V V IN 2+V OUT 2 ) + ( 0.5 ) ( C2 ) ( V RIPPLE 2
-
OUT RIPPLE
]xf
OSC
EQUATION 5-3:
I OUT VRIPPLE = ---------------------------- + 2 ( I OUT ) ( ESRC2 ) ( f OSC ) ( C2 )
5.0.2
CHARGE PUMP EFFICIENCY
f V+ VOUT
The overall power efficiency of the charge pump is affected by four factors: 1. Losses from power consumed by the internal oscillator, switch drive, etc. (which vary with input voltage, temperature and oscillator frequency). I2R losses due to the on-resistance of the MOSFET switches on-board the charge pump. Charge pump capacitor losses due to effective series resistance (ESR). Losses that occur during charge transfer (from the commutation capacitor to the output capacitor) when a voltage difference between the two capacitors exists.
C1
C2
RL
2. 3. 4.
FIGURE 5-1: Model.
REQUIV
Ideal Switched Capacitor
V+
VOUT C2 RL
Most of the conversion losses are due to factors 2, 3 and 4 above. These losses are shown in Equation 5-1.
1 R EQUIV = -------------f x C1
EQUATION 5-1:
P LOSS ( 2, 3, 4 ) = IOUT 2 x R OUT
1 I OUT 2 x -------------------------- + 8R SWITCH + 4ESR C1 + ESR C2 ( f OSC )C1
FIGURE 5-2: Resistance.
Equivalent Output
The 1/(fOSC)(C1) term in Equation 5-1 is the effective output resistance of an ideal switched capacitor circuit (Figures 5-1 and 5-2).
(c) 2010 Microchip Technology Inc.
DS21488B-page 13
TCM828/TCM829
5.0.3 CAPACITOR SELECTION 5.0.5 VOLTAGE INVERTER
In order to maintain the lowest output resistance and output ripple voltage, it is recommended that low ESR capacitors be used. Additionally, larger values of C1 will lower the output resistance and larger values of C2 will reduce output ripple. (See Equation 5-1). Table 5-1 shows various values of C1 and the corresponding output resistance values @ +25C. It assumes a 0.1 ESRC1 and 2 RSW. Table 5-2 shows the output voltage ripple for various values of C2. The VRIPPLE values assume 10 mA output load current and 0.1 ESRC2. The most common application for charge pump devices is the inverter (Figure 5-3). This application uses two external capacitors - C1 and C2 (plus a power supply bypass capacitor, if necessary). The output is equal to V-IN plus any voltage drops, due to loading. Refer to Table 5-1 and Table 5-1 for capacitor selection. VOUT C3
3.3 F*
TABLE 5-1:
C1 (F) 0.1 1 3.3 10 47 100
I
OUTPUT RESISTANCE VS. C1 (ESR = 0.1)
TCM829 ROUT () 302 45 25 19 17 17 850 100 42 25 18 17
VOUT 1 OUT TCM828/ TCM829 2 5 C1+ C1
3.3 F*
C2
3.3 F*
TCM828 ROUT ()
IN
RL
3 C1-
GND
4
Voltage Inverter *10 F (TCM828)
TABLE 5-2:
OUTPUT VOLTAGE RIPPLE VS. C2 (ESR = 0.1) IOUT 10MA
TCM829 ROUT () 286 88 31 8 5
FIGURE 5-3: 5.0.6
Test Circuit.
CASCADING DEVICES
C2 (F) 1 3.3 10 47 100
TCM828 VRIPPLE (mV) 835 254 85 20 10
Two or more TCM828/829 devices can be cascaded to increase output voltage (Table 5-4). If the output is lightly loaded, it will be close to (- 2 x VIN) but will droop at least by ROUT of the first device multiplied by the IQ of the second. It can be seen that the output resistance rises rapidly for multiple cascaded devices. For large negative voltage requirements see the TC682 or TCM680 data sheets. ... V+IN 2 C1 3 TCM828/ 4 TCM829 5 "1" 3 C1 1
TCM828/
5.0.4
INPUT SUPPLY BYPASSING
The VIN input should be capacitively bypassed to reduce AC impedance and minimize noise effects due to the switching internal to the device. The recommended capacitor depends on the configuration of the TCM828/TCM829 devices. If the device is loaded from OUT to GND, it is recommended that a large value capacitor (at least equal to C1) be connected from the input to GND. If the device is loaded from IN to OUT, a small (0.1 F) capacitor is sufficient.
2 4 TCM829 5 ... C2 "n" 1 VOUT C2
VOUT = -nVIN
FIGURE 5-4: Cascading TCM828 or TCM829 Devices to Increase Output Voltage.
DS21488B-page 14
(c) 2010 Microchip Technology Inc.
TCM828/TCM829
5.0.7 PARALLELING DEVICES
To reduce the value of ROUT, multiple TCM828/ TCM829 devices can be connected in parallel (Figure 5-5). The output resistance will be reduced by a factor of N, where N is the number of TCM828/ TCM829 device. Each device will require it's own pump capacitor (C1), but all devices may share one reservoir capacitor (C2). However, to preserve ripple performance, the value of C2 should be scaled according to the number of paralleled TCM828/ TCM829 devices.
V+IN 2 D1, D2 = 1N4148
3 C1
4
TCM828/ TCM829
1
D1 VOUT = V-IN C2 D2 VOUT = (2VIN) (VFD1) - (VFD2) C4
5
OF SINGLE DEVICE V ROUT = OUT NUMBER OF DEVICES
C3
V+IN . . . 3 C1 2 3 C1 1
TCM828/ 4 TCM829
2
FIGURE 5-6: Inverter. 5.0.9
Combined Doubler and
TCM828/ 4 TCM829
DIODE PROTECTION FOR HEAVY LOADS
5
"1"
5
"n"
1
VOUT C2
... VOUT = V-IN
FIGURE 5-5: Paralleling TCM828 or TCM829 Devices to Reduce Output Resistance. 5.0.8 VOLTAGE DOUBLER/INVERTER
When heavy loads require the OUT pin to sink large currents, being delivered by a positive source, diode protection may be needed. The OUT pin should not be allowed to be pulled above ground. This is accomplished by connecting a Schottky diode (1N5817) as shown in Figure 5-7. 4
GND TCM828/ TCM829
Another common application of the TCM828/TCM829 devices is shown in Figure 5-6. This circuit performs two functions in combination. C1 and C2 form the standard inverter circuit described above. C3 and C4, plus the two diodes, form the voltage doubler circuit. C1 and C3 are the pump capacitors, while C2 and C4 are the reservoir capacitors. Because both sub-circuits rely on the same switches, if either output is loaded, both will drop toward GND. Make sure that the total current drawn from both the outputs does not total more than 40 mA.
OUT
1
FIGURE 5-7: 5.0.10
High V- Load Current.
LAYOUT CONSIDERATIONS
As with any switching power supply circuit, good layout practice is recommended. Mount components as close together as possible, to minimize stray inductance and capacitance. Also use a large ground plane to minimize noise leakage into other circuitry.
(c) 2010 Microchip Technology Inc.
DS21488B-page 15
TCM828/TCM829
NOTES:
DS21488B-page 16
(c) 2010 Microchip Technology Inc.
TCM828/TCM829
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
5-Lead SOT-23 Example:
Device
Code CANN CWNN CBNN
XXNN
TCM828ECT728 TCM828VT713 TCM829ECT713-GVAO
CA25
Legend: XX...X Y YY WW NNN
e3
*
Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package.
Note:
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.
(c) 2010 Microchip Technology Inc.
DS21488B-page 17
TCM828/TCM829
PIN 1
User Direction of Feed
Device Marking Device Marking
User Direction of Feed
W
PIN 1 Standard Reel Component Orientation TR Suffix Device (Mark Right Side Up)
P Reverse Reel Component Orientation RT Suffix Device (Mark Upside Down)
Carrier Tape, Number of Components Per Reel and Reel Size
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
5-Pin SOT-23
8 mm
4 mm
3000
7 in
FIGURE 6-1:
Component Taping Orientation for 5-Pin SOT-23 (EIAJ SC-74A) Devices.
DS21488B-page 18
(c) 2010 Microchip Technology Inc.
TCM828/TCM829
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(c) 2010 Microchip Technology Inc.
DS21488B-page 19
TCM828/TCM829
5-Lead Plastic Small Outline Transistor (CT) [SOT-23]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
DS21488B-page 20
(c) 2010 Microchip Technology Inc.
TCM828/TCM829
APPENDIX A: REVISION HISTORY
Revision B (August 2010)
The following is the list of modifications: 1. 2. 3. Added new operating temperature for TCM828 (TCM828VT). Reformatted the original document. Updated package drawings.
Revision A (March 2001)
* Original Release of this Document.
(c) 2010 Microchip Technology Inc.
DS21488B-page 21
TCM828/TCM829
NOTES:
DS21488B-page 22
(c) 2010 Microchip Technology Inc.
TCM828/TCM829
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range /XX Package Examples: a) TCM828ECT728: Extended Temp., 5-LD SOT-23 Package. Various Temperature 5-LD SOT-23 Package.
Device:
TCM828: TCM829:
CMOS Voltage Converter. CMOS Voltage Converter.
b)
TCM828VT713:
Temperature Range: E V
= -40C to +85C = -40C to +125C
c)
Package:
CT = 5-Lead Plastic Small Outline Transistor, SOT-23.
TCM829ECT713-GVAO: Extended Temp., 5-LD SOT-23 Package.
(c) 2010 Microchip Technology Inc.
DS21488B-page 23
TCM828/TCM829
NOTES:
DS21488B-page 24
(c) 2010 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
*
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2010, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
ISBN: 978-1-60932-445-2
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
(c) 2010 Microchip Technology Inc.
DS21488B-page 25
WORLDWIDE SALES AND SERVICE
AMERICAS
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ASIA/PACIFIC
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ASIA/PACIFIC
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EUROPE
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07/15/10
DS21488B-page 26
(c) 2010 Microchip Technology Inc.


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